RHI Showcases Next-Generation Data Center Solutions at DCW Asia 2026

RHI successfully concluded its participation in Data Centre World Asia 2026, held on September 29–30 at Marina Bay Sands Expo and Convention Centre in Singapore.

At the event, RHI showcased a range of high-current power and thermal management solutions developed for high-density and AI-driven data center infrastructure. The portfolio covers Rack Busbar, Power Busbar, and OCP ORv3 Rack Busbar Solutions, supporting reliable and efficient power distribution at both system and rack levels.

As AI computing continues to drive higher rack power densities, RHI presented AI Rack Busbar Solutions and High-Density Rack Power Busbars engineered to meet the demanding power requirements of next-generation data centers. For liquid-cooled infrastructure, Liquid-Cooled Rack DC Busbar Solutions combine high-current power distribution with thermal design considerations, supported by Liquid Cooling Thermal Simulation for thermal analysis and design optimization.

RHI also presented Liquid Cooling Quick Coupling Solutions for dependable liquid-cooling connections, together with Optical Module Heat Spreader Solutions designed to support efficient thermal management in high-power optical applications.

The event provided an opportunity for RHI to engage with data center operators, system integrators, engineers, and industry professionals, while gaining valuable insights into the evolving requirements of AI and high-density computing infrastructure.

Looking ahead, RHI will continue to advance customized power connection and thermal management solutions for AI data centers, high-density computing, and next-generation digital infrastructure.

Looking for a customized data center power solution? Contact RHI to discuss your requirements.